The Datapath Express7-G3 backplane provides four x8 lane PCI Express 3.0 slots typically intended for hosting input cards, and three x16 lane PCI Express 3.0 slots targeted for hosting output cards.
The Express7-G3 can be used with a standard PICMG 1.3 single-board computer (SBC) as a stand-alone system or in combination with multiple backplanes to provide a PCI Express expansion system for a standard PC.
Star Configuration
The four x8 PCI Express slots in the master chassis (containing the SBC) can be populated with an HLink-G3 card. Each HLink-G3 is then connected to an expansion chassis using an ExCable-G3 and SLink-G3 card. This configuration provides a high number of available PCI Express slots supporting low latency. The Express7-G3 can be used to connect a mixture of multiple Datapath Express7-G3, Express9 and Express9-G3, and Express11-G3 backplanes.
Daisy Chain Configuration
Expansion Link – HLink-G3, ExCable-G3 and SLink-G3
The SLink-G3 card can be used instead of a PICMG 1.3 SBC to configure the Express7-G3 as an expansion backplane from a standard PC or from other Datapath backplanes. The cards are available with Gen.3 compatibility, fully supporting the Datapath Express7-G3 backplane.
| Product Name/Order Code | Description |
| Express7-G3 | 7 slot PCI Express Gen.3 expansion backplane |
| Max Power (without SBC) | 25W |
| Power Requirements | Max current at +3.3V < 0.5A Max current at +12V < 0.5A Max current at +5V < 4A |
| Form Factor | PICMG1.3 Host SBC interface (x16 PCIe) 3x PCI Express (x16) expansion slots 4x PCI Express (x8) expansion slots |
| ATX PSU | 1 x 24 pin power connectors 8 x 8 pin AUX power connectors |
| SATA Ports | 2 x ports via PICMG1.3 interface |
| USB Ports | 2 x ports via PICMG1.3 interface (USB 2.0) |
| Operating Temperature | 0 to 35°C / 32 to 95°F |
| Storage Temperature | -20 to 70°C / -4 to 158°F |
| Relative Humidity | 5% to 90% non-condensing |
We are continuously developing the technology used within our product ranges delivering outstanding innovative solutions, therefore the specification may change from time to time.