The Datapath Express11-G3 backplane provides 11 eight lane PCI Express slots, all implemented as x16 physical connectors.
They can be used with a standard PICMG 1.3 SBC as a stand-alone system or in combination with multiple backplanes to provide a PCI Express expansion system for a standard PC.
This backplane uses advanced PCI Express 3.0 switches to create high bandwidth that connects up to 11 PCI express plug in cards into a host system.
The Datapath Express11-G3 uses PCIe Gen.3 switches to provide each slot with up to 8GB/s bi-directional bandwidth.
Using multiple Express11-G3 backplanes configured in a daisy chain expansion mode allows for the construction of large systems. The Express11-G3 can also be expanded using a star configuration. This configuration enables the construction of very large systems supporting low latency with a high number of slots.
Star Configuration
All x8 PCI Express slots in the master chassis (containing the SBC) are populated with an HLink-G3 card. Each HLink-G3 is then connected to an expansion chassis using an ExCable-G3 and SLink-G3 card. This configuration provides a high number of available PCI Express slots supporting low latency.
Daisy Chain Configuration
Daisy chain the main chassis to a maximum of five expansion chassis providing up to 51 PCI Express expansion slots.
| Product Name/Order Code | Description |
| Express11-G3 | 11 slot PCI Express Gen.3 Expansion backplane PCIe 3.0 switch |
| Max Power (without SBC) | 25W |
| Power Requirements | Max current at +3.3V <0.5A Max current at +12V <0.5A Max current at +5V <4A |
| Form Factor | PICMG1.3 Host SBC interface (x8 PCIe) 11 x PCI Express (x8) expansion slot |
| ATX PSU | 2 x 24 pin power connectors 2 x 8 pin AUX power connectors |
| SATA Ports | 2 x ports via PICMG1.3 interface |
| USB Ports | 2 x ports via PICMG1.3 interface, USB 2.0 |
| Operating Temperature | 0 to 35°C / 32 to 95°F |
| Storage Temperature | -20 to 70°C/ -4 to 158°F |
| Relative Humidity | 5% to 90% non-condensing |
We are continuously developing the technology used within our product ranges delivering outstanding innovative solutions, therefore the specification may change from time to time.